By Prasad, K.R. (February 2022) 

Semiconductors are critical in many commonly used electronic devices such as smartphones, tablets, IoT devices and PCs with chip makers Intel and Samsung Electronics being the largest companies in this industry. There are various types of manufacturing, one being front end semiconductor manufacturing that represents the initial series of steps in a semiconductor fabrication workflow. They typically follow crystal growth and wafer extraction, and precede so-called back end processes involving integrated circuit (IC) assembly. A combination of extreme accuracy and precision is needed and this complex manufacturing chain is normally handled by a series of partners specialising in one or more semiconductor manufacturing processes – which is part of the reason why the semiconductor industry was so vulnerable to supply chain issues precipitated by the pandemic. 

Smaller sizes and geometries are expected by customers in next-generation semiconductor technology, which is where polymer sealing solutions can be beneficial in the more demanding and challenging manufacturing processes seen in today’s current landscape. Polymer materials can handle harsher chemicals and higher temperatures that contribute to the wear and tear on the equipment. This extends the life of equipment, reduces overall cost and protects against sealing failures.