- Semiconductor Polymer Solutions
Ryan Herco Flow Solutions Selected As Semiconductor Seal & Material North American Distributor
Semiconductor Polymer Solutions
Omniseal Solutions™, a design engineering and manufacturer of precision sealing solutions and materials for over 60 years, has selected Ryan Herco Flow Solutions (RHFS), as a distributor of its Omniseal® polymer and metal seals; and Meldin® polyimide material solutions for semiconductor applications in the North American market.
Established in 1948 and headquartered in Burbank, California, Ryan Herco Flow Solutions serves 40 geographic markets in the United States, Canada, Mexico, and Asia. The B2B business has extensive experience providing semiconductor customers with a host of high-performance solutions for a variety of applications. Additionally, RHFS offers highly trained logistics and customer service specialists, including specific semiconductor sales associates in the Northeast and Northwest territories (Texas, AZ, UT, ID, MT, and CA), with established international sales support from a facility in Southeast Asia that serves Singapore and Malaysia.
“As an engineering and manufacturing business, we are dedicated to precision and customer focus. Ryan Herco Flow Solutions is a precision fit and will drive our customer-centric approach and business model, working closely in Chemical Mechanical Planarization (CMP), etching, vacuum processes and more critical applications. Due to their sales team having relevant industry experience, they are capable of providing personalized field support and solving challenges with our Omniseal® polymer seals, metal seals, and Meldin® polyimide materials.” says Helene Petregne, Omniseal Solutions’ Global Distribution Manager.
Omniseal® spring-energized, polymer seals are used in a variety of critical industries due to handling a wide range of temperature and pressure as well as offering excellent chemical resistance. In the semiconductor industry, most applications require very high levels of purity. Operating environments for seals are challenging as a result of the use of plasmas and chlorinated gases in extreme temperatures or vacuum conditions. Furthermore, these seals are typically exposed to highly aggressive, corrosive fluids and can lead to premature failure or rapid degradation.
After the acquisitions of American Seal Engineering (ASE) and High Tech Metal Seals (HTMS), Omniseal Solutions™ strengthened their solutions portfolio with a wide range of metal sealing solutions. Metal seals are used for their higher temperature and pressure as well as extreme low leakage.
Meldin® polyimide materials are selected for semiconductor applications as polymers are known to resist contamination, reduce friction to a minimum, exhibit high dimensional stability at high temperatures, and provide longer life at higher loads and speeds.
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