Applications
Semiconductor: Metal Seals Applications
Description
Omniseal® Metal Face Seals are used in semiconductor applications due to their ability to withstand very high temperatures, vacuum and corrosive gases without leaking, outgassing or shedding particles onto wafers.
Shaped seal for process chamber
Shaped seal for laser source (lithography)
More Information
Temperature:
Pressure:
Leakage Rates:
Seal Diameter:
Cross Sections:
Clamping Load:
Surface Finish:
Oxygen Cleaning:
From -269°C to +1000°C (-452°F to +1832°F); higher temperatures available on request
From ultra-high vacuum (UHV) to 6894 bar (100,000 psi)
To 1×10⁻¹² mbar·l/s (plated + spin polished)
Face—8 mm to 7000 mm (0.3" to 275.6")
Axial—8 mm to 400mm (0.3" to 15.7")
0.79 mm to 12.70 mm (0.031" to 0.500"); non-standard available on request
Up to 150 N/mm
Face: Ra 0.2 to 1.6 um; Axial: Ra 10 um
As required
Depending on the type of Metal Seal, the solution can be used for static and semi-dynamic face or axial sealing in extreme temperature, pressure, vacuum, and radiation environments.
Applications include:
- Low to moderate load with high spring back (C-Seal, V-Seal, E-Seal)
- Medium to high load with increased spring back and wider sealing surface (Spring-Energized C-Seal)
- Ultra-high vacuum and cryogenic sealing (Aluminium Spring-Energized Seal, O-Ring)
- Shaft and bore sealing in semi-dynamic, rotary, and reciprocating applications (Axial C-Seal, Lip Seal, Comma Seal)
- Non-circular and shaped geometries (Shaped Seal, Machined Seal)
- High spring back for large flange movement or thermal cycling (V-Seal, E-Seal)
- High seating stress for rough surface finishes or soft flange materials (Spring-Energized C-Seal, Aluminium Spring-Energized Seal)
- Long-term static sealing under radiation exposure (C-Seal, Spring-Energized C-Seal)
- Standard fitting interfaces (Boss Seal for AS5202, E-Seal for AS1895)
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